Advances in EDA design methodologies led


FPGAs have become some of the most important drivers for development of leading edge semiconductor technology. The complexity of programmable devices, and their integration of diverse high-performance functions, provides excellent vehicles for testing new processes. It’s no accident that Intel has selected Achronix and Tabula, both makers of programmable devices, as the only partners that have been granted access to their 22 nm 3D Tri-Gate (FinFET) process. In February, Intel also announced an agreement with Altera, which will enable the company to manufacture FPGAs using their next-generation 14 nm Tri-Gate process.

In Vehicle computer, single board computer, Embedded pc

In parallel with driving manufacturing, FPGA technology development must also include enhancements to design tools and flows. As vendors strive to make their devices more SoC- and ASIC-like, they are also adopting standards and collaborating with EDA companies to integrate their tools more seamlessly. These collaborations are producing great benefits for designers, as FPGA design methodologies are leading the way in areas that the EDA industry has long been promising new capabilities, such as in Electronic System Level (ESL) synthesis, IP integration and re-use, and higher-level tools for software/hardware co-design.

FPGA design methodologies have long integrated EDA point tools, such as simulation and PCB design, into FPGA vendor’s design platforms. Now, vendors such as Synopsys, with their Synplicity tools, and Xilinx with Vivado, are collaborating to build more complete integrated top-to-bottom flows. To address the greater complexity of FPGAs that may now contain up to two million equivalent logic cells, Synopsys has added Hierarchical Project Management (HPM) to Synplicity. HPM supports distributed design teams and parallel development, enabling partitioning of RTL and sharing of design debug tasks. Xilinx has adopted the industry-standard Synopsys Design Constraint (SDC) timing constraints (to replace Xilinx proprietary UDC) in a design flow that can be driven from standard Verilog HDL.

1.EASING IP INTEGRATION

2.INDUSTRY STANDARDS ENABLE HIGHER LEVELS OF ABSTRACTION

3.THE FUTURE OF FPGAS

 

 

 

 

refer to :

http://dsp-fpga.com/articles/advances-in-eda-design-methodologies-led-by-next-generation-fpgas/

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Happy holiday for AFE designs

Vehicle computer, single board computer, Embedded pc

Vehicle computer, single board computer, Embedded pc

Because the coming of the holiday, the tool itself already has libraries of different sensor profiles, it is easy for a systems engineer to have a starting point in their design. A graphical representation of the output signals from the AFE can be used to monitor systems with close-to-real-time feedback, which will make it very easy to make the AFE adjustments and tuning. All these embedded features reduce complexity in development and thus reduce resource costs.

Once the embedded configuration is set, the tool outputs a register file that can be used by the software on the MCU. The MCU stores the sensor settings in on-chip flash (nonvolatile) memory within its firmware, and when power is applied to the system, the MCU sends the stored settings to registers in the Smart Analog IC, reconfiguring that chip accordingly.

refer to: http://embedded-computing.com/articles/latest-afe-simplifies-interfacing-hundreds-sensors/#at_pco=cfd-1.0

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5 most desirable choppers for embedded systems (ES)

In Vehicle computer, single board computer, Embedded pc

In Vehicle computer, single board computer, Embedded pc

Embedded Chopper stabilization is required to achieve high sensitivity in latching Hall effect sensors for BLDC motor commutation

Truth: Chopper stabilization is not the only way to achieve high sensitivity. Other technologies and processes are available to manufacturers for high-sensitivity magnetic sensing.

As an alternative to chopper stabilization, Honeywell Sensing and Control has developed a high-sensitivity bipolar latching embedded sensor by combining a quad Hall element and proprietary programming without chopper stabilization. This programming adjusts the magnetics to account for the effects of packaging stresses, thus contributing to the sensor’s high sensitivity. This design offers the required high sensitivity and stable magnetics for BLDC motors, along with the embedded benefits of faster response time, repeatability, improved jitter performance and no additional electric noise generation.

 

refer to :http://industrial-embedded.com/articles/busting-three-myths-chopper-stabilization/

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AMB-D255T1 & AMB-N280S1 Price Crash

In-Vehicle computer, single board computer, Embedded pc

the new Atom series solutions that include AMB-D255T1 Mini-ITX industrial mainboard and AMB-N280S1 fanless 3.5-inch single board computer. AMB-D255T1 is equipped with Intel D2550 Atom processor and Intel N2800 Atom processor is on AMB-N280S1 both have 5~7 years product life cycle for longevity support.

 AMB-D255T1 features powerful graphic performance via VGA and HDMI output, one DDR3 SO-DIMM socket, mSATA socket with USB signals and SIM slot, and a +12V DC jack for easy power input.

AMB-N280S1 has variety I/O ports like 5 x serial ports (one is RS-232/422/485 selectable), 4 x USB2.0, 2 x GbE RJ-45 ports, and one Mini-PCIe expansion. It also offers 1 x SATA interface and power connector for the customers have large storage capacity request.

 

Contact:
http://www.acrosser.com/inquiry.html

 

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Longer medical device life expectancy

In vehicle computer, single board computer, Embedded pc

In vehicle computer, single board computer, Embedded pc

Like many other industries, health care has become much more agile as practitioners have tried to keep expenses under control. Smaller, more portable devices now enable more efficient and economical diagnostic and treatment procedures to be delivered at the patient’s bedside. Computers-On-Modules (COMs) are helping provide the portability, computing power, and integration needed to increase the longevity of medical device designs.

Electronic device manufacturers are increasingly using Computers-On-Modules (COMs) to produce compact, portable, and easily modified solutions for health care. In addition to smaller solutions, COMs enable longer product life, which is particularly desirable in medical equipment. One reason for this is the stringent and expensive certification process medical devices go through as mandated by the FDA. Furthermore, successful products often become industry standards that medical technicians must learn and adhere to.

By definition, COM designs are modular. The COM approach for embedded technology enables a medical solution’s processing power to be easily updated or upgraded while the physical dimensions and mounting system remain exactly the same. This allows the appearance of the industrial design to stay consistent with market expectations while providing for any needed upgrades. If a particular processor is reaching End-Of-Life (EOL), a module with a current processor can be introduced.

With COMs, the processor and supporting features are placed on a compact module that comprises a complete computer. The I/O for the system and the unique features that differentiate the customer’s product are included on a separate baseboard. Processor upgrades can be made by utilizing different processing modules that mate with the baseboard. This enables easy processor upgrades, plus various modules can be offered spanning a range of performance levels.

refer:

http://embedded-computing.com/articles/com-device-life-expectancy/

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New exhibitors and international share of exhibitors, which confirms the importance of the event

In Vehicle computer, single board computer, Embedded pc

In Vehicle computer, single board computer, Embedded pc

The international embedded community meets for three days at its annual highlight in Nürnberg from 26–28 February – the embedded world Exhibition&Conference. The exhibition has been the main hub of one of the most dynamic and highly specialized technology sectors for over 10 years. It is the world’s biggest international exhibition and conference event on embedded system technology.
 
embedded world has been the most important event in the international exhibition calendar for both exhibitors and visitors for a decade.
It is also the world’s biggest special-interest exhibition for embedded technologies.
 
Acrosser technology  —————->Booth Hall 2 2-519
 
 
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The perfect solution AMB-QM77T1 with 3rd Core i

The AMB-QM77T1 is the newest Mini-ITX industrial mainboard from Acrosser Technology that supports both of the 3rd and 2nd generation Intel Core i7/i5/i3 mobile processor by Intel QM77 chipset and FCPGA 988 socket.

in-Vehicle computer, single board computer, Embedded pc

Coming with Acrosser’s 7 years product longevity service, AMB-QM77T1 is the perfect solution to deliver high computing power for a wide range of applications such as medical, industrial automation, kiosk, digital signage, and ATM machines.

 

The key features of the AMB-QM77T1 include:
‧  Intel QM77 chipset
  FCPGA socket supports 3rd Generation Intel® Core(TM) i7/i5/i3 processors and Celeron
  2* DDR3-1600/1333/1066 SO-DIMM up to 16GB
  Supports VGA/DVI-D/HDMI/LVDS displays
  Support 3 independent display
  Dual Intel PCI-E Gigabit LAN
  8* USB 2.0, 4* USB 3.0, 3* COM, 3* SATA II, 2* SATA III
  1* PCI-E x16, 1* Mini PCI-E, 1* CFast socket
  iAMT 8.0, TPM 1.2, Watchdog timer, Digital I/O Support VGA and DVI output

 

 

 

 

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Support the optional GPS/GPRS/WiFi module inside one compact system

AR-V6005 & AR-V6100 also support the optional GPS/GPRS/WiFi module inside one compact system, to fulfill the highly demand from telematic applications.

AR-V6005FL features:
• Intel Atom E640 1.0GHz Processor + EG20T
• DDR2 1GB onboard
• Intelligent Power module support 9~32VDC input
Fanless design system
• Dual Display:VGA (via Combo Connector), DVI
• RS-232 interface:3 x External ( 1 x RS232/422/485 switch selectable), 1 x Internal
• IO:USB x 1, MIC-in/Speaker, GbE x 1
• Storage:CF card / 2.5” HDD bay
• Optional module:Bluetooth / GPS / WiFi / 3.5G GSM module
• 9-32 VDC power input
• –20℃ to 60℃ operation temperature

 AR-V6100FL features:
• Fanless system supports 45W PGA Intel Core i7/i5 and Celeron processors
• Two DDR3 SO-DIMM with 2GB DDR3 pre-installed
• HDMI/DVI/VGA video outputs
• CAN bus 2.0 A/B
• Optional Wi-Fi, Bluetooth, 3.5G, GPS Modules
• RS-232 Interface:2 x External (1 x RS232/422/485 switch selectable), 1 x Internal
• Storage:CF / 2.5” HDD bay
• One-wire (i-Button) interface
• 9-32 VDC power input
• –20℃ to 60℃ operating temperature

In-Vehicle computer, single board computer, Embedded pc

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FCPGA 988 socket for 3rd generation Core i mobile computer platform

In-Vehicle computer, single board computer, Embedded pc

In-Vehicle computer, single board computer, Embedded pc

AIV-HM76V0FL is protected with the most complete power input protection to adapt the harsh electrical environment in any kind of vehicle. Such protections are automotive transient voltage suppression, over/under voltage protection, over current protection, reverse voltage protection and automotive fuse. These designs enable AIV-HM76V0FL to pass the strict ISO-7637-2 test what is specifically defined for equipments installed in various vehicles.

  The smart power management subsystem enables user to define the power on and off sequences through software interface or BIOS setting to meet any requirement of in-vehicle applications.

The AIV-HM76V0FL’s fanless thermal design provides the high reliability in vehicle applications. It utilizes advanced heat pipe, heat sink, and thermal pad to solve the problem of heat generated by CPU, Chipset, DRAM and power devices. This is a big challenge for designing a fanless computer what supports up to 45 Watts quad core of core i7-3720QM processors. All components used in AIV-HM76V0FL are industrial proven and only solid state capacitors are utilized for high MTBF.

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With CoreTM i7/ i5/ i3 Mini-ITX Motherboard

Vehicle computer, single board computer, Embedded pc

Vehicle computer, single board computer, Embedded pc

The Intel 3rd generation desktop processors supported by the AMB-IH61T1 features an integrated GPU, which is capable of supporting such graphical libraries as DirectX11, OpenGL4.0 and OpenCL1.1, targeting on multimedia and gaming applications.

AMB-IH61T1 is the perfect solution to deliver high computing power for a wide range of applications such as industrial automation, kiosk, digital signage, and ATM machines

The key features of the AMB-IH61T1 include:

 
‧ Intel H61 Express chipset
‧ LGA1155 socket supports 3rd Generation Intel® Core(TM) i7/i5/i3 desktop processors and Celeron processors
‧ Supports Intel Xeon E3-1200 series Processors
‧ 2x DDR3-1333/1066 SO-DIMM up to 16GB
‧ Supports VGA/DVI-D/LVDS dual displays
‧ Dual Realtek PCI-E Gigabit LAN
‧ 6* USB 2.0, 6* COM, 3* SATA II
‧ 1* PCI-E x4, 1* Mini PCI-E
‧ Watchdog timer, 8-bit Digital I/O
‧ All Solid Capacitors

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